@techreport{trammell-plus-spec-01,
    number =    {draft-trammell-plus-spec-01},
    type =      {Internet-Draft},
    institution =   {Internet Engineering Task Force},
    publisher = {Internet Engineering Task Force},
    note =      {Work in Progress},
    url =       {https://datatracker.ietf.org/doc/draft-trammell-plus-spec/01/},
    author =    {Brian Trammell and Mirja Kühlewind},
    title =     {{Path Layer UDP Substrate Specification}},
    pagetotal = 17,
    year =      2017,
    month =     mar,
    day =       13,
    abstract =  {This document specifies a common Path Layer UDP Substrate (PLUS) wire image for encrypted transport protocols carried over UDP. The base PLUS header carries information for driving a minimal state machine at middleboxes described in {[}I-D.trammell-plus-statefulness{]}, and provides optional exposure of additional information to devices along the path using the mechanism described in {[}I-D.trammell-plus-abstract-mech{]}.},
}